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If a sector is programmed or reprogrammed sequentially page-by-page, then the programming
algorithm shown in <blue>Figure 1 on <blue>page 26 is recommended. Otherwise, if multiple
bytes in a page or several pages are programmed randomly in a sector, then the programming
algorithm shown in <blue>Figure 2 on <blue>page 27 is recommended. Each page within a sec-
tor must be updated/rewritten at least once within every 10,000 cumulative page erase/program
operations in that sector.
Operation Mode
Summary
Pin Descriptions
The modes described can be separated into two groups – modes which make use of the Flash
memory array (Group A) and modes which do not make use of the Flash memory array (Group
B).
Group A modes consist of:
1. Main Memory Page Read
2. Main Memory Page to Buffer 1 (or 2) Transfer
3. Main Memory Page to Buffer 1 (or 2) Compare
4. Buffer 1 (or 2) to Main Memory Page Program with Built-in Erase
5. Buffer 1 (or 2) to Main Memory Page Program without Built-in Erase
6. Page Erase
7. Block Erase
8. Main Memory Page Program through Buffer
9. Auto Page Rewrite
Group B modes consist of:
1. Buffer 1 (or 2) Read
2. Buffer 1 (or 2) Write
3. Status Register Read
If a Group A mode is in progress (not fully completed) then another mode in Group A should not
be started. However, during this time in which a Group A mode is in progress, modes in Group B
can be started.
This gives the Serial DataFlash the ability to virtually accommodate a continuous data stream.
While data is being programmed into main memory from buffer 1, data can be loaded into buffer
2 (or vice versa). See application note AN-4 (“Using Atmel’s Serial DataFlash”) for more details.
SERIAL INPUT (SI): The SI pin is an input-only pin and is used to shift data into the device. The
SI pin is used for all data input including opcodes and address sequences.
SERIAL OUTPUT (SO): The SO pin is an output-only pin and is used to shift data out from the
device.
SERIAL CLOCK (SCK): The SCK pin is an input-only pin and is used to control the flow of data
to and from the DataFlash. Data is always clocked into the device on the rising edge of SCK and
clocked out of the device on the falling edge of SCK.
CHIP SELECT (CS): The DataFlash is selected when the CS pin is low. When the device is not
selected, data will not be accepted on the SI pin, and the SO pin will remain in a high-impedance
state. A high-to-low transition on the CS pin is required to start an operation, and a low-to-high
transition on the CS pin is required to end an operation.
8
AT45DB081B
2225J–DFLSH–2/08
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相关代理商/技术参数
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功能描述:闪存 8M SERIAL 2.7V - 2.5V IND TEMP RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel
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功能描述:闪存 8M 28 I/O Pins SPI 264B 2.7V RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel
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制造商:ATMEL 制造商全称:ATMEL Corporation 功能描述:8-megabit 2.5-volt or 2.7-volt DataFlash
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制造商:ATMEL 制造商全称:ATMEL Corporation 功能描述:8-megabit 2.5-volt or 2.7-volt DataFlash
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制造商:ATMEL 制造商全称:ATMEL Corporation 功能描述:8-megabit 2.5-volt or 2.7-volt DataFlash
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制造商:AD 制造商全称:Analog Devices 功能描述:8-megabit 2.5V or 2.7V DataFlash
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制造商:Adesto Technologies Corporation 功能描述:WHOLE WAFER, NO BACKGRIND - Gel-pak, waffle pack, wafer, diced wafer on film